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Transforming how Naval ships, aircraft, submarines, and unmanned systems operate

As the distinguished ONR ManTech Center of Excellence for Electronics, we proudly operate within the state-of-the-art Electro-Optics & Electronics Division (EO&E) Building at the renowned Penn State Applied Research Laboratory, a distinguished U.S. Navy University Affiliated Research Center (UARC). Located in Freeport, PA, the Electronics Manufacturing Center (EMC) shares its dynamic space with the Electro-Optics Center (EOC), a longstanding ONR ManTech Center of Excellence for Electro-Optics since 1999.

Our core objective is clear: identify, develop, and facilitate the seamless transition of electronics manufacturing technologies. By doing so, we aim to dramatically reduce both the cost and deployment time of electrical and electronic systems—encompassing both digital and analog realms, and by supporting power storage and distribution infrastructure.

Scope of the EMC

The scope of the Electronics Manufacturing Center includes aspects of materials, components, devices /
ICs, integrated circuits, interconnection, embedded systems, and subsystems / systems, along with
systems that assure the integrity of electronics that transition into Navy platforms.

Our personnel and technical contributors are experienced in most facets of electronics manufacturing, with experts in the Applied Research Laboratory, in The Pennsylvania State University, and collaborators in the electronics manufacturing industry. Our facility has multiple laboratories dedicated to technology research and development, offices and meeting rooms, and spaces for performing DoD classified work

  • Manufacturing technology
  • Power electronics
  • Precision timing and navigation
  • Semiconductor devices
  • Trusted electronics hardware
  • Vacuum electronics
  • Resilient electronics hardware
  • Microwave electronics
  • Passive components
  • Thermal management
  • Emerging technologies
  • Integrated circuit technologies
  • MEMS
  • Sustainment / Obsolescence
  • MICs and MMICs
  • Packaging technology
  • COTS integration
  • Interconnections
  • Non-hermetic packaging
  • U.S. industrial base
  • Compound semiconductors
  • Tamper proof / resistant
  • Supply chain integrity
  • Wide bandgap
  • Energy storage / distribution
  • Counterfeit detection
  • Wide bandgap semiconductors